NXP FTF China Showcases Solutions for a Smarter World

During the NXP FTF China Tech Forum keynote, NXP Semiconductors kicked off its 10th year anniversary celebration since its founding as a standalone semiconductor company, with NXP CEO Rick Clemmer, highlighting the key trends that are driving the company’s growth – ADAS, Internet of Things (IoT), security, automotive and payments.
 
“As NXP celebrates a decade, we’re reminded of how important innovations in security and connectivity, key partnerships and ecosystem convergence has been in both the evolution of a smarter world and our company growth,” said Clemmer. “Here at NXP FTF China, we are demonstrating our vitality notably in automotive, IoT, payment and transit technologies.”
 
NXP FTF China took place at the Shenzhen Intercontinental Hotel, Sept. 28-29. At the event, the company announced key collaborations and unveiled new solutions for IoT, automotive and smart kitchens.
 
NXP announced it is collaborating with Changan Automobile and Neusoft to establish the China Auto Security Common Interests Group (CIG). The group brings together a hardware-based industry cooperative organization for automotive security with local automotive and software partners in the global market. CIG will adopt “NXP 4 plus 1 security framework” – the highest level of car information security today.
 
NXP and Xiaomi Inc. announced they are successfully deploying best-in-class technologies to implement secure, convenient mobile transit experiences countrywide across China’s popular metro stations and public bus lines. Since initial launch of the mobile transit services in June, activation rates grew more than 15% in Shanghai and more than 20% in Shenzhen among commuters. And with Xiaomi’s recent launch of Mi Pay, featuring NXP’s embedded secure element (eSE) technology, consumers will benefit from the highest level of security for transactions from both bank and transportation accounts.
 
NXP is collaborating with Midea to achieve breakthrough R&D innovations in smart kitchen appliances. NXP has brought revolutionary changes to Midea products through technological innovations: the semiconductor-heating cube demonstrated at the Tech Forum is the first result of this cooperation
 
NXP announced its expansion of the industry leading MagniV microcontrollers product line and introduced a broad portfolio of hardware, software and integrated motor control solutions designed to dramatically speed time to market.
 
In addition, NXP also extended its leadership in secure car access technology to car-side systems with the introduction of the NJJ29C0 Low Frequency transceiver. As a leader in advanced key fob designs, NXP now enables full system solutions that combine longer-range performance and enhanced convenience for end-users, together with reduced costs, faster time-to market and greater design freedom for OEMs and their tier one suppliers.
 
At NXP FTF China, NXP officially unveiled the i.MX 6ULL – the lowest power ARM Cortex-A7-based applications processor in the market. The i.MX6 ULL processor, designed for the growing IoT consumer and industrial, mass markets, delivers up to 30% more power efficiency than its nearest competitors and is available at breakthrough prices.
 
NXP introduced the industry’s first automotive 15W wireless charging solution, qualified to meet stringent automotive and industrial grade requirements. Compatible with WPC Qi and PMA charging standards, this complete solution allows automakers to easily transition from 5W to 15W capabilities, giving drivers a faster in-vehicle charging experience for mobile phones, tablets and wearables.